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Freescale Semiconductor Design Engineer II Interview Questions & Reviews

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Design Engineer II at Freescale Semiconductor

Accepted Offer – Interviewed in Tel Aviv-Yafo (Israel) Jan 2008 – Reviewed Nov 17, 2012

Interview Details – was invited to interview after job fair in Technion.
pass 2 technical interviews duting a week and get offer

Interview Question – Explain how FIFO is built,
how to build a speedometer on base top/down counter
how arbitration works,
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Design Engineer II at Freescale Semiconductor

Accepted Offer – Interviewed in Bangalore (India) Jul 2011 – Reviewed Nov 14, 2012

Interview Details – Technical Interview was tough. Wide variety of questions asked in signal processing, OFDM, LTE, DSP , cache basics, OS,RTOS, C.
Many levels of interview, HR round is about why you want to join the company.
Hiring itself was a long drawn affair, took 2 months to complete.

Interview Question – Explain fft/dft algo, custom memcpy, digital downsampling etc.   Answer Question

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