Very Difficult Interview
The process took a day - interviewed at IM Flash Technologies in April 2011.
Interview Details – I had a brief interview with an engineer at my college. A couple weeks later they called me and asked me to fly out for a more rigorous interview process. First night there the company gave a presentation and a one mile tour around the facility. Next morning I was asked to appear at the building. I was first interviewed by HR which was mostly the general HR questions you would expect. Next I was interviewed by two engineers for about an hour. They asked me a large amount of technical questions. Next I was interviewed by a five person panel who again asked me a great deal of technical questions. This lasted at least an hour and a half. Very nice people. Lastly, I was interviewed by one more engineer and then left the building after about 4 hours of interviewing.
Interview Question – Don't really remember specific questions. Mostly general knowledge of SEM's, TEM's, FIB's and the wafer creation process. Answer Question
In January 2006, Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, and Intel Corporation, the world’s largest chip maker, came together to form a new company: IM Flash… — Full Overview
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