Intel Corporation Interview Review
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Intel Corporation Product Development Engineer Interview
Posted Jun 23, 2011 2011-06-23 19:50 PDT
2.0
Easy Interview
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Overall Positive Experience
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Received and Accepted Offer
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Interviewed Jun 2011 in Folsom, CA (took 2 days)
Interview Process Started off with a phone interview in late April.
Interviewer asked a series questions on
1: DFT Techniques
2: PERL/TK
3: PCI Express
I was able to answer all questions satisfactorily.
I was shortlisted for FM Rush Interviews in Early June.
The Interview consisted of 3 rounds of technical questions and behavioral from Senior Technical staff.
First round basically consisted of DFT Basics and How I can perform SCAN techniques on different chips and some behavioral questions.
Second Round consisted of technical questions related to various lab bench testing devices like Oscilloscopes, Logic Analyzers and Functional waveform generators. The interviewer also asked some questions on various projects I have done in my Master's relating to the use of lab equipment and a few questions regarding Jitter an eye patterns were asked.
Third Round concerned with device physics, basic circuit design questions and in-depth analysis of some of my projects was done.
Interview Questions
Other Details
I Applied Online and the interview consisted of a Phone Interview, a 1:1 Interview, a Presentation and a Skills Test.
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