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Proving that the last shall be first, Advanced Systems Automation (ASA) makes automated backend equipment for semiconductor assembly. It began as a manufacturer of semiconductor tools, and shifted to equipment for semiconductor encapsulation, the final stage of device packaging. Branching out, ASA launched machines for ball grid array packages, along with a flip chip bonder. ASA's Microfits (Beijing) Technology offers equipment contract manufacturing for medical devices, packaging, and scientific instrumentation industries. ASA customers include chip makers, Cypress...
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