BE Semiconductor Industries
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Where would BE Semiconductor Industries (BESI) be without semiconductor packaging and plating equipment? Semiconductor manufacturers use BESI's packaging and plating gear in the finishing steps of chip production. The company's Fico subsidiary makes package molding and trims and form systems that put the final touches on a chip. BESI also sells plating, singulation, and flip chip die attach systems. The company has reworked its portfolio of subsidiaries to exit the market for chip leadframes and to enter the market for die-sorting equipment. BESI's global client roster...
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