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Shinkawa manufactures industrial bonding, assembly, and sorting machinery and equipment for the production of semiconductors. The company's bump bonders, die bonders, flip chip bonders, tape bonders, and wire bonders are used primarily in the finishing stages of silicon chip manufacturing. Shinkawa's products bond chips to their lead frames and connect them to the electrodes of the frame with gold or aluminum wire. The company operates internationally through its subsidiaries in China, Malaysia, the Philippines, Singapore, South Korea, Thailand, Taiwan, and the US.