Introducing the world’s first monolithic, SOI Wi-Fi front-end module. http://glassdoor.com/slink.htm?key=vQIi8
RF Globalnet interviewed Mumtaz Bora, a senior staff packaging engineer at pSemi, to explore a typical day, job requirements and challenges of being a packaging engineer. Take a "behind the scenes look" into her packaging career.
Stop by our IMS Booth #1349 to learn more about the world's first Digital Step Attenuator that operates from 9 kHz to 50 GHz. We are excited to lead RF innovation for 5G mmWave products.
Find out more about the GaN FET driver with the industry's fastest rise time at our IMS Booth #1349.
We have some exciting new products at IMS this year (Booth #1349). These front-end Switch+LNA modules deliver an ultra-low noise figure and low power consumption.
We've extended our DSA product line this week to provide high-performance 2-, 5-, 6-, and 7-bit DSAs at a great price point.
How did you arrive at the name pSemi? Read our executive interview in Microwave Journal.
We're honored to be recognized for the 2nd consecutive year on the "IEEE Spectrum" Patent Power Scorecard. http://glassdoor.com/slink.htm?key=vQUWm
pSemi will serve as Murata’s semiconductor arm and is tasked with growing rapidly to support its expanding product portfolio and the hiring of engineers and professionals globally.
Peregrine Semiconductor is now pSemi. http://glassdoor.com/slink.htm?key=vQU2P