I applied online. I interviewed at Oxford Instruments (San Francisco, CA) in Jul 2024
Interview
Was contacted by a recruiter, she screened me by communicating technical responses to a hiring manager. Interview with hiring manager was scheduled, and I had a 1 hour interview. The second interview was pretty challenging, and expected a depth of knowledge I didn't have.
Interview questions [3]
Question 1
Recruiter asked: Do you have experience with plasma etching?
Recruiter asked basic questions based on my resume (skill-sets, qualification, visa status). She also asked me how much I expect to get for the salary.
Hiring manager asked:
1. Can you explain the difference between ICP and CCP?
2. Explain how ellipsometry works
3. What are the important deposition parameters for a metal contact
4. Difference between common semiconductor capital equipment
5. How would you quantify surface roughness of a material?
