Packaging Engineer applicants have rated the interview process at Rochester Electronics with 2 out of 5 (where 5 is the highest level of difficulty) and assessed their interview experience as 100% positive. To compare, the company-average is 71.4% positive. This is according to Glassdoor user ratings.
Candidates applying for Packaging Engineer roles take an average of 10 days to get hired, when considering 1 user submitted interviews for this role. To compare, the hiring process at Rochester Electronics overall takes an average of 11 days.
Common stages of the interview process at Rochester Electronics as a Packaging Engineer according to 1 Glassdoor interviews include:
Skills test: 50%
Presentation: 50%
Here are the most commonly searched roles for interview reports -
I applied online. The process took 1+ week. I interviewed at Rochester Electronics
Interview
HR was very nice in answering the questions and guiding through the interview process. Interviewer was very nice, too. The interview was mostly about my expertise, the questions were simple, and ordinary.
Interview questions [1]
Question 1
simple questions about job and its function and my expertise