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      ASIC Physical Design Engineer II Interview

      Jul 14, 2020
      Anonymous Interview Candidate
      Bengaluru
      Declined offer
      Positive experience
      Difficult interview

      Application

      I applied online. The process took 1+ week. I interviewed at SignOff Semiconductors (Bengaluru) in May 2020

      Interview

      I had applied through linkedIn. It was a telephonic interview. There were 3 technical rounds and 1 HR round. It took around 10 day to get offer. It was a very good experience.

      Interview questions [1]

      Question 1

      Tell me about yourself and work experience? Explain ASIC flow? What is Scan chain insertion? USe? What is scan chain reordering? Why macros are placed preferably at boundary and not at centre? What all physical only cells you cam across ? Explain? Checks before placement? How do you fix timing at Place? Difference between CCD and CTS? What is HFNS? Why it is not done at syn? Aim of CTS? What happens in route? What are NDR ? Explain side flows? Types of placement blockages? What is derate? what is LVS? what is FEV? Kind of buffers used for CTS? How do you select them?
      1 Answer
      2