Round 1 : Written test
Round 2 : Technical interview - I
Round 3 : Technical interview - II
Round 4 : Technical interview- III ( May/ May not be)
Round 5 : HR interview
Interview questions [1]
Question 1
Written Test :
The written test consist of questions from aptitude, digital electronics, electronic circuits, C programming , MPMC and other core subjects related to electronics
Round 2, 3 & 4:
Interview questions are based on digital electronics, verilog, C programming and other core related concepts
Round 5:
General HR questions like whether agreeing for bond or not..etc
The process took 1 day. I interviewed at SmartDV Technologies
Interview
The whole process took a day. First round is written test that consists of digital, analog, microprocessor, c++ and aptitude questions.
The second is the technical interview. It is based on the area of interest and C/C++ concepts with more questions in digital domain.
The third round is CEO round, which is like a general HR round.
I applied through college or university. The process took 1 day. I interviewed at SmartDV Technologies in Dec 2015
Interview
The interview took one day..among 250 candidates only 3 were selected. The HR was only concerned on the candidates acceptance for 4 years bond. They checked our personal background and guessed whether the family will send the candidate or not.
1st round - written - aptitude and technical questions(digital electronics based)
2nd round - face to face technical(digital electronics based)
Interview questions [1]
Question 1
1.multiplexers (mostly digital electronics topics)
