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      Intel Corporation

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      PACKAGING R&D ENGINEER Interview

      Nov 4, 2019
      Anonymous Interview Candidate
      Chandler, AZ

      Other PACKAGING R&D ENGINEER Interview Reviews for Intel Corporation

      PACKAGING R&D ENGINEER Interview

      Apr 27, 2022
      Anonymous employee
      Accepted offer
      Positive experience
      Average interview
      No offer
      Neutral experience
      Average interview

      Application

      I applied through college or university. The process took 1 day. I interviewed at Intel Corporation (Chandler, AZ) in Sep 2019

      Interview

      I applied through my University's job application portal: Handshake and was called the next day for a phone screen directly by the Hiring Manager. After a week, I was invited on-site at Intel, Chandler for a day-long interview. It was scheduled from 9 am to 5 pm, meeting 1:1 with 2 mechanical engineering team leads and 3 senior engineers with several breaks in between. There were 4 other candidates interviewing that day. The 1:1 interviews were a mix of behavioral and technical questions, mostly asking about my previous experiences and things on my resume. The technical questions were mechanical engineering-related: stress-strain curve, heat transfer, CTE, DOE, Statistical Analysis, DFM, Structural Mechanics, FEA and injection molding. Most of the questions were testing problem-solving ability and how one thinks out of the box. The last 1 hour was scheduled for a Solidworks test, in which, I was given an isometric view of a tool holder to be designed as a 3D model, followed by assembly and 2D drafting and dimensioning. Ask several questions along the way, if you get stuck, ask. The design test was really interesting and was geared to test one's comfort with Solidworks, how one dimensions, and the use of correct steps to achieve an efficient output (Least number of clicks and keystrokes). Negatives: It was a great experience overall, everyone there was positive and cheerful. However, after the interview, it took them 1 month to send a rejection email, that too an automated one with no feedback. When asked for feedback, no one replied. I was asked to fill out a reimbursement form to cover the travel for the interview, but, never got the reimbursement. Not that I care about the reimbursement, but no feedback is very unprofessional.

      Interview questions [7]

      Question 1

      What is CTE Mismatch? How can it be avoided?
      Answer question

      Question 2

      Draw and explain the Stress-Strain curve.
      Answer question

      Question 3

      Draw and explain an SFD and BMD for a simply supported beam.
      Answer question

      Question 4

      What is Root Cause Analysis and explain your project?
      Answer question

      Question 5

      Given the choice of Flathead and Philips head screw, which would you select? What are the advantages and disadvantages of both?
      Answer question

      Question 6

      What are some DFM considerations when designing for Injection Molding?
      Answer question

      Question 7

      Which material would you select if the product needs to have a high cosmetic value, needs to be hard and have the ability to withstand constant thermal cycling?
      Answer question
      1

      Application

      I applied online. I interviewed at Intel Corporation

      Interview

      The team was very friendly but asked keen questions from my resume. The hiring manager mostly asked questions about my fit for the position. Very constructive interview with lots of learning.

      Interview questions [1]

      Question 1

      What exactly do you expect for this role?
      Answer question

      PACKAGING R&D ENGINEER Interview

      Feb 28, 2022
      Anonymous employee
      Accepted offer
      Positive experience
      Average interview

      Application

      I interviewed at Intel Corporation

      Interview

      Initial phone call interview, was described the position and asked a few questions relating to knowledge of polymer science and instrumental analysis. Then was allowed to ask a few questions back to the interviewer.

      Interview questions [1]

      Question 1

      Strengths and weaknesses? Describe an instrument, how it functions?
      Answer question

      PACKAGING R&D ENGINEER Interview

      Feb 22, 2022
      Anonymous employee
      Accepted offer
      Positive experience
      Average interview

      Application

      I interviewed at Intel Corporation

      Interview

      1. 1 st round is a 30 min phone screening 2. 2nd round is an 1h presentation on research and nine 1:1 sessions. most questions are about presentation. also ask a lot of behavior questions.

      Interview questions [1]

      Question 1

      1. why do you want this job
      Answer question