I applied through a recruiter. I interviewed at Meta (New York, NY) in May 2024
Interview
Had a phone interview with the recruiter and then a technical screening with one of the engineers. They provide interview prep material, but I did not find it useful. Be prepared for questions that you are not normally asked in other interviews.
Interview questions [1]
Question 1
1. Effects of fatigue on stress strain curves. How does the yield point change with each loading? Show where the yield point is on the curve.
2. Tolerance stack ups (Monte Carlo, RSS and worst-case scenario) and other GD&T questions like flatness, surface profile.
3. Cantilever beam questions (PCB has metal wires connected to it. How would you change its rigidity)
4. In what ways would you mount PCBs in a plastic housing.
5. Thermal stresses when a PCB is heated to a certain temperature.
Focus on fundamentals (thermal, optics, mechanical engineering) with lots of product based engineering questions both for initial and full loop interview. Focus on plastic design (injection molding), optical design, material science and GD&T for preparation.
The interview was a technical assessment for a Product Design Engineer position. It included a wide array of technical questions, covering everything from the design phase to manufacturing processes. While the questions weren't particularly difficult, they were broad in scope, requiring a comprehensive understanding of the product development lifecycle.
Straight forward interview format with an initial HR call, followed by a technical interview with a product design engineer. Format for the technical interview was well established and straight forward.