Glassdoor users rated their interview experience at Microchip as 40% positive with a difficulty rating score of 2.8 out of 5 (where 5 is the highest level of difficulty). Candidates interviewing for Physical Design Engineer and Firmware Engineer rated their interviews as the hardest, whereas interviews for Physical Design Engineer and Validation Engineer I roles were rated as the easiest.
The hiring process at Microchip takes an average of 60 days when considering 5 user submitted interviews across all job titles. To compare, the average duration of hiring at similar companies like BlackRock, Inc. is 14 days, Fabricated Software, Inc. is 2 days, and Apple Inc. is 21 days. Candidates applying for Firmware Engineer had the quickest hiring process (on average 60 days), whereas Firmware Engineer roles had the slowest hiring process (on average 60 days).
First interview had a quick phone call. Simple questions about debugging, what would you do in x scenario, what have you done in the field. No technical questions asked in the first inverview.
Interview questions [1]
Question 1
What would you do if a manual had incomplete documentation?
I applied through college or university. The process took 2 weeks. I interviewed at Microchip (Silchar) in May 2023
Interview
There were 3 rounds in the process. The first round was screening of the resumes of all the applied candidate. The second round was technical interview which lasted for around 1 hour. Main topics asked are C/C++ and OOPS. The last round was HR Round which lasted for 15 min and asked about relocation.
Interview questions [1]
Question 1
What is difference between run time and compile time polymorphism?
I applied online. I interviewed at Microchip (Bengaluru)
Interview
Smooth interview. Happened online interview. Three rounds of interview were there. One round of written test, two rounds of technical tests.
Sta, physical design, asic design flow, digital, complementary metal oxide semi conductor questions.
Interview questions [1]
Question 1
Smooth interview. Happened online interview. Three rounds of interview were there. One round of written test, two rounds of technical tests.
Sta, physical design, asic design flow, digital, complementary metal oxide semi conductor questions.