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Amkor Snapshot
Mission:
Amkor delivers agile and dependable manufacturing and supply chain solutions developed in close collaboration with our customers.
Vision:
To be the preferred manufacturing services partner, enabling innovative semiconductor packaging
Amkor delivers agile and dependable manufacturing and supply chain solutions developed in close collaboration with our customers.
Vision:
To be the preferred manufacturing services partner, enabling innovative semiconductor packaging
Amkor founded in 1968, Amkor’s continuous path of improvement,
growth and innovation has led us to be a strategic and trusted
manufacturing partner for the world’s leading semiconductor
companies. Our unique expertise in high-volume manufacturing
techniques and the ability to solve the technological challenges
facing the industry are among our greatest strengths.
Customer demand for highly sophisticated products has
made semiconductor packaging a vital contributor to system
performance. As one of the world’s largest suppliers of
outsourced semiconductor advanced packaging design,
assembly and test services, Amkor helps make innovative
technologies a reality.
Amkor offers more than 1,000 different package formats
and sizes. Products range from traditional leadframe ICs for
through-hole and surface mounting to the latest chip scale
packages (CSP) and ball grid array (BGA) solutions required in
high pin count and high density applications.
Our diverse portfolio includes stacked die, wafer level, MEMS,
flip chip, Through Silicon Via (TSV) and 2.5/3D packaging,
allowing us to be a single source for many of our customers.
We fulfill total semiconductor packaging requirements
from legacy devices to System in Package (SiP) solutions.
The availability of high quality packaging services allows
customers to focus their resources on semiconductor design
and wafer fabrication while utilizing Amkor as their packaging
technology innovator and test partner.
AMKOR PHILOSOPHY
We build our business by helping our
customers build theirs.
growth and innovation has led us to be a strategic and trusted
manufacturing partner for the world’s leading semiconductor
companies. Our unique expertise in high-volume manufacturing
techniques and the ability to solve the technological challenges
facing the industry are among our greatest strengths.
Customer demand for highly sophisticated products has
made semiconductor packaging a vital contributor to system
performance. As one of the world’s largest suppliers of
outsourced semiconductor advanced packaging design,
assembly and test services, Amkor helps make innovative
technologies a reality.
Amkor offers more than 1,000 different package formats
and sizes. Products range from traditional leadframe ICs for
through-hole and surface mounting to the latest chip scale
packages (CSP) and ball grid array (BGA) solutions required in
high pin count and high density applications.
Our diverse portfolio includes stacked die, wafer level, MEMS,
flip chip, Through Silicon Via (TSV) and 2.5/3D packaging,
allowing us to be a single source for many of our customers.
We fulfill total semiconductor packaging requirements
from legacy devices to System in Package (SiP) solutions.
The availability of high quality packaging services allows
customers to focus their resources on semiconductor design
and wafer fabrication while utilizing Amkor as their packaging
technology innovator and test partner.
AMKOR PHILOSOPHY
We build our business by helping our
customers build theirs.
