Lam Research Company Updates | Glassdoor

Company Updates

  • Lam Research is a proud platinum sponsor of SEMICON West, which takes place virtually July 20-23. Visit our latest blog post to see our presentation schedule as well as reserve your spot ? we?ll be presenting about the latest technological breakthroughs, sharing insights into attracting and retaining diverse employees, and more:

  • See Lam Research China’s presentations at SEMICON China’s virtual event China Semiconductor Technology International Conference (CSTIC), a comprehensive industry conference that will be available virtually until July 17. Read more about our participation and sponsorship in our latest blog post:

  • Due to the integration of artificial intelligence, machine learning, and augmented reality in the medical industry, doctor and patient interactions have become more efficient and treatments are becoming more precise. In our latest blog post, read more about how Lam Research advances innovation by improving semiconductor manufacturing and chip technology:

  • Our latest blog post outlines Lam Research’s presentation schedule at the AVS 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020), which you can join virtually Monday, 6/29 through Wednesday, 7/1. Lam Research is a proud sponsor of the event and looks forward to sharing the latest chipmaking discoveries. See more details, including how to register, here:

  • Even though the annual Heart & Soles Run/Walk couldn’t happen in person this year, hundreds of registered participants still took part in the challenge and showed their support for the healthy-student programs virtually. To read more about the beneficiaries, visit our blog:

  • Explore the latest technologies in the semiconductor industry with our CTO Rick Gottscho. From memory and equipment scaling to new market demands, and the driving factors behind changes in manufacturing – he’s got you covered. Read more via our blog:

  • As chips become more sophisticated high density fan-out wafer-level packaging, or FOWLP, has gained wider acceptance as a packaging solution. Read about its advantages and potential for the future in our latest blog post:

  • eSports, a form of competitive online gaming, has gone from niche to mainstream and continues to draw millions of viewers. Our latest blog post explores the technological innovations that made it possible, including improved internet speeds and processing power:

  • With plasma making up nearly 99.9% of the universe, Keren Kanarik, a senior technical director at Lam Research, explains the mysterious matter and explores how it's harnessed to fuel the modern electronics industry.

  • We’re proud to be participating in Ecochallenge.org’s Earth Month EcoChallenge, an online program that supports and encourages sustainable practices. Learn more:

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