Interview process was very good, there were lots of technical discussion and the problems which i was not aware of. interview panel was highly talented and very good technical. Panel was very friendly so that was making me comfortable to deliver my answers in front of them.

First telephonic,then f2f managerial round and finally hr.. i have cleared all the rounds even hr shared the salary breakout letyer via email and gave the acknowledgement that they will send the offer letter on soon. After following up via phone and emails, i got only one reply that letter approval is on hold,please wait.. its more than 2months now...