Logic & Aptitude Test (30 mins, 25 questions):
A timed test assessing problem-solving, analytical thinking, and pattern recognition. It includes logic puzzles and scheduling constraints.
First-Round Interview (Technical Interview):
A panel of engineers will test your semiconductor knowledge, including process development, data analysis (SPC, DOE, FMEA), and troubleshooting manufacturing issues. Some basic coding and automation-related questions may also be asked.
Second-Round Interview (Behavioral & Team Fit):
A more in-depth discussion with senior engineers or managers, focusing on leadership, collaboration, and adaptability. Expect scenario-based questions about handling challenges in a fast-paced environment.