Texas Instruments Packaging Engineer interview questions
Updated Apr 20, 2024Difficulty
Average
Experience
Very positive
How others got an interview
- 20%Campus RecruitingCampus Recruiting
Interview search
6 interviews
Texas Instruments interviews FAQs
- Packaging Engineer applicants have rated the interview process at Texas Instruments with 3.2 out of 5 (where 5 is the highest level of difficulty) and assessed their interview experience as 83% positive. To compare, the company-average is 72% positive. This is according to Glassdoor user ratings.
- Candidates applying for Packaging Engineer roles take an average of 26 days to get hired, when considering 6 user submitted interviews for this role. To compare, the hiring process at Texas Instruments overall takes an average of 24 days.
- Common stages of the interview process at Texas Instruments as a Packaging Engineer according to 6 Glassdoor interviews include:
Phone interview: 19%
One on one interview: 19%
Background check: 13%
Personality test: 13%
Skills test: 13%
Group panel interview: 13%
Drug test: 6%
Other: 6%
Here are the most commonly searched roles for interview reports -
- Analog Design Engineer(229) ;
- Software Engineer(188) ;
- Applications Engineer(141) ;
- Intern(141) ;
- Engineer(136) ;
- Test Engineer(127) ;
- Design Engineer(126) ;
- Product Engineer(121) ;
- Digital Design Engineer(115) ;
- Process Engineer(111) ;
- Systems Engineer(101) ;
- Equipment Engineer(90) ;
- Internship(83) ;
- Field Applications Engineer(79) ;
- Product Marketing Engineer(78) .