Packaging Engineering Intern applicants have rated the interview process at Texas Instruments with 2.5 out of 5 (where 5 is the highest level of difficulty) and assessed their interview experience as 100% positive. To compare, the company-average is 72% positive. This is according to Glassdoor user ratings.
Candidates applying for Packaging Engineering Intern roles take an average of 6 days to get hired, when considering 2 user submitted interviews for this role. To compare, the hiring process at Texas Instruments overall takes an average of 24 days.
Common stages of the interview process at Texas Instruments as a Packaging Engineering Intern according to 2 Glassdoor interviews include:
One on one interview: 67%
Presentation: 33%
Here are the most commonly searched roles for interview reports -
I applied online. I interviewed at Texas Instruments in Nov 2021
Interview
Video Conference with 2 engineers on the Packaging team at Texas Instruments. Great conversation with two very interesting people, they seemed genuinely interested in what I had to say. They helped me frame my answers by using my resume as a template to ask answers off of.
Interview questions [1]
Question 1
Describe a time when you dealt with conflict within a team?
I applied through college or university. The process took 6 days. I interviewed at Texas Instruments in Sep 2021
Interview
It was pretty simple, with a current employee. I basically was asked to walk him through my resume. I mostly talked about my research work in the semiconductor packaging. He also explained the type of work TI does in this field.